The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Jul. 02, 2021
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Yasuhiro Nishisaka, Nagaokakyo, JP;
Mitsuru Ikeda, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component includes a multilayer body including a multilayer main body including internal nickel electrode layers exposed at end surfaces thereof, external nickel layers on the end surfaces of the multilayer body, and external copper electrode layers covering one of the end surfaces. When dimensions of the external nickel layer and the multilayer body are TN and T, a relationship of TN<Tis satisfied. When dimensions of the external nickel layer and the multilayer body are WN and W, a relationship of WN<Wis satisfied. The internal nickel electrode layers include at least one uncovered region. The internal nickel electrode layers are directly bonded to the external copper electrode layers in the uncovered region. At least one diffusion region is provided in which copper of the external copper electrode layers is diffused.