The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Apr. 15, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Yuuji Igarashi, Nagaokakyo, JP;

Akio Igarashi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 27/30 (2006.01); H01F 41/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 27/306 (2013.01); H01F 41/10 (2013.01);
Abstract

A coil component includes a wire; a core having a winding core around which the wire is wound and a flange portion provided at an end portion of the winding core in an axial direction; and a terminal electrode to which the wire is connected and that is provided on the flange portion. The terminal electrode has a projecting portion that sticks out in the axial direction relative to the flange portion. The projecting portion has a flat surface along which the wire is thermocompression-bonded. Thermocompression bonding of the wire is performed in a state where an interval between a head surface of a heater chip and the flat surface becomes narrower from a flange portion side toward a front end side of the projecting portion. A degree of crushing of the wire decreases from the front end side toward the flange portion side of the projecting portion.


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