The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Mar. 18, 2020
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

Ashutosh Joshi, Roscoe, IL (US);

Debabrata Pal, Hoffman Estates, IL (US);

Assignee:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/10 (2006.01); H01F 27/28 (2006.01); H01F 17/06 (2006.01); H01F 27/02 (2006.01); H01F 27/08 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2876 (2013.01); H01F 17/062 (2013.01); H01F 27/02 (2013.01); H01F 27/085 (2013.01); H01F 27/10 (2013.01); H01F 27/2895 (2013.01);
Abstract

A thermal management includes an inductor, a housing in thermal communication with the inductor, the housing defining a wall, and a conductor. The conductor has a greater heat transfer rate than the wall and is positioned within a groove and/or an aperture formed in the wall. The conductor is configured to transfer heat through the wall more efficiently than if the conductor were not present. A method of manufacturing a thermal management system includes forming a housing by additive manufacturing. The housing defines a wall having at least one of a groove and an aperture defined therein. The method includes positioning a conductor in at least one of the groove and the aperture. The conductor has a greater heat transfer rate than the wall. The method includes positioning an inductor into thermal communication with the housing.


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