IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11594363 B1

PDFFull Text
Date of Patent:
Feb. 28, 2023

Filed:

Apr. 27, 2020

Coil component and wireless power transmission device provided with the same

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Tomohiro Moriki, Tokyo, JP;

Takahiro Ohishi, Tokyo, JP;

Hirohumi Asou, Tokyo, JP;

Noritaka Chiyo, Tokyo, JP;

Toshio Tomonari, Tokyo, JP;

Junpei Hamaya, Tokyo, JP;

Shigeki Ohtsuka, Tokyo, JP;

Takaaki Imai, Tokyo, JP;

Takakazu Maruyama, Tokyo, JP;

Osamu Taguchi, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Young Law Firm, P.C.

Primary Examiner:

Ryan Johnson

Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/245 (2006.01); H01F 38/14 (2006.01); H01F 5/00 (2006.01); H02J 7/00 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H02J 50/10 (2016.01); H01F 27/36 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 5/003 (2013.01); H01F 17/0013 (2013.01); H01F 27/245 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/36 (2013.01); H01F 38/14 (2013.01); H02J 7/0042 (2013.01); H02J 50/10 (2016.02); H01F 2027/2809 (2013.01); H01F 2027/297 (2013.01);
Abstract

Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.

Find Patent Forward Citations

Loading…