The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Jun. 23, 2020
Applicant:

Pukyong National University Industry—university Cooperation Foundation, Busan, KR;

Inventor:

Hansang Kwon, Busan, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); G01R 31/28 (2006.01); G01R 1/04 (2006.01); H01R 13/10 (2006.01); H01R 13/03 (2006.01); B22F 1/10 (2022.01); C08L 33/08 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2863 (2013.01); B22F 1/10 (2022.01); B22F 3/105 (2013.01); G01R 1/0441 (2013.01); H01R 13/03 (2013.01); H01R 13/10 (2013.01); B22F 2003/1051 (2013.01); B22F 2202/13 (2013.01); B22F 2301/052 (2013.01); B22F 2301/058 (2013.01); B22F 2302/10 (2013.01); B22F 2302/20 (2013.01); C08L 33/08 (2013.01);
Abstract

This application relates to a method of preparing a composite material for a semiconductor test socket, and a composite material prepared through the method. In one embodiment, the method includes preparing a powder mixture including (i) a metal powder comprising aluminum or aluminum alloy particles and magnesium particles and (ii) a polymer powder. The method may also include sintering the powder mixture to produce the composite material using a spark plasma sintering (SPS) process. This application also relates to a method of manufacturing a semiconductor test socket, the method including forming an insulating portion of the semiconductor test socket with the composite material. This application further relates to a semiconductor test socket produced through the method.


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