The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

Jan. 08, 2019
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Wataru Toya, Annaka, JP;

Keita Kitazawa, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/12 (2006.01); C08L 83/04 (2006.01); C08G 77/08 (2006.01); C08G 77/14 (2006.01); C08G 77/20 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 5/14 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C08G 77/08 (2013.01); C08G 77/12 (2013.01); C08G 77/14 (2013.01); C08G 77/20 (2013.01); C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 5/14 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/2296 (2013.01); C08L 2203/20 (2013.01); C08L 2205/035 (2013.01);
Abstract

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m·° C.) per 100 total parts by mass of components (A) and (B).


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