The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Apr. 04, 2018
Corning Incorporated, Corning, NY (US);
Satish Chandra Chaparala, Cupertino, CA (US);
Kristen Lorraine Eckart, Corning, NY (US);
Kurt Edward Gerber, Dansville, NY (US);
Ming-Huang Huang, Ithaca, NY (US);
Nagaraja Shashidhar, Painted Post, NY (US);
Huan-Hung Sheng, Horseheads, NY (US);
Michael Lesley Sorensen, Waverly, NY (US);
Ananthanarayanan Subramanian, Corning, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
A multi-layer and method of making the same are provided. The multi-layer, such as a sensor, can include a high strength glass overlay and a lamination layer on a substrate layer. The overlay can be less than 250 micrometers thick and have at least one tempered surface incorporating a surface compression layer of at least 5 micrometers deep and a surface compressive stress of at least 200 MPa. The overlay can exhibit a puncture factor of at least 3000 N/μmat B10 (10percentile of the probability distribution of failure) in a multi-layer structure, an apparent thickness of less than 0.014 mm, and a pencil hardness greater than 6H. The method can include ion-exchange tempering at least one major surface of a glass sheet, light etching the major surface to remove flaws and laminating the glass sheet on the tempered and lightly etched major surface to a substrate layer.