The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Oct. 06, 2020
Applicant:
Knowles Electronics, Llc, Itasca, IL (US);
Inventor:
Timothy Pachla, Berwyn, IL (US);
Assignee:
Knowles Electronics, LLC, Itasca, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 3/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81B 3/0021 (2013.01); B81B 3/0072 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract
A transducer assembly can include a base. The transducer assembly can include a stress isolation standoff located on the base. The transducer assembly can include a MEMS die disposed on the stress isolation standoff. The transducer assembly can include a die attach adhesive disposed between the MEMS die and the base. The die attach adhesive can bond the MEMS die to the base. The stress isolation standoff can be embedded in the die attach adhesive between the base and the MEMS die.