The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Mar. 17, 2020
Applicant:
Lantech.com, Llc, Louisville, KY (US);
Inventors:
Patrick R. Lancaster, III, Louisville, KY (US);
Michael P. Mitchell, Louisville, KY (US);
Christian Michael Gruner, Louisville, KY (US);
Jean-Louis Limousin, Louisville, KY (US);
Assignee:
Lantech.com, LLC, Louisville, KY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65H 26/02 (2006.01); G01L 5/102 (2020.01); B65B 57/04 (2006.01); B65B 41/16 (2006.01); B65B 11/02 (2006.01); B65B 11/04 (2006.01); B65B 11/00 (2006.01);
U.S. Cl.
CPC ...
B65B 57/04 (2013.01); B65B 11/02 (2013.01); B65B 11/025 (2013.01); B65B 11/045 (2013.01); B65B 41/16 (2013.01); B65H 26/025 (2013.01); G01L 5/102 (2013.01); B65B 2011/002 (2013.01); B65H 2408/40 (2013.01);
Abstract
A method, apparatus and program product may evaluate a packaging material to determine various metrics associated with the packaging material. A test apparatus may be used to evaluate packaging material using a take up drum capable of sensing containment force imparted upon the drum by packaging material applied thereto, and in some instances, simulated flaws may be formed in a web of packaging material to evaluate a packaging materials response to such flaws when under tension.