The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Jul. 21, 2020
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventor:
Akira Yane, Tokyo, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/32 (2006.01); B32B 27/20 (2006.01); B32B 27/36 (2006.01); B32B 27/34 (2006.01); B29C 70/78 (2006.01); B29C 70/84 (2006.01); C08K 3/04 (2006.01); C08L 25/06 (2006.01); G03G 15/08 (2006.01); B32B 27/30 (2006.01); C08L 23/08 (2006.01); B29K 25/00 (2006.01); B29K 623/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B29C 70/78 (2013.01); B29C 70/84 (2013.01); B32B 27/18 (2013.01); B32B 27/302 (2013.01); B32B 27/306 (2013.01); C08K 3/04 (2013.01); C08L 23/0853 (2013.01); C08L 25/06 (2013.01); G03G 15/0868 (2013.01); B29K 2025/06 (2013.01); B29K 2623/083 (2013.01); B32B 2250/02 (2013.01); B32B 2307/202 (2013.01); G03G 15/0851 (2013.01);
Abstract
A resin member includes a base material and a resin molded body disposed on the base material, the resin molded body containing a main component constituted by an ethylene-vinyl acetate copolymer resin and a carbon black. The resin molded body has two or more peaks within a range of 25° C. to 80° C. in an endothermic curve obtained through measurement performed by heating from 25° C. to 150° C. at 5° C./min with a differential scanning calorimetry (DSC) apparatus.