The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 2023

Filed:

May. 18, 2021
Applicant:

Arris Composites Inc., Berkeley, CA (US);

Inventors:

Ethan Escowitz, Berkeley, CA (US);

Riley Reese, Oakland, CA (US);

J. Scott Perkins, Oakland, CA (US);

Erick Davidson, Piedmont, CA (US);

Assignee:

Arris Composites Inc., Berkeley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); B29C 70/24 (2006.01); B29C 70/38 (2006.01); B29C 70/44 (2006.01); B29C 70/70 (2006.01); B29C 70/88 (2006.01); B32B 5/12 (2006.01); B32B 5/22 (2006.01); B32B 5/24 (2006.01); C04B 35/20 (2006.01); C04B 35/581 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); B29K 307/04 (2006.01); B29K 101/12 (2006.01); B29K 105/08 (2006.01); B29L 31/34 (2006.01); B29K 309/08 (2006.01);
U.S. Cl.
CPC ...
B29C 70/70 (2013.01); H05K 1/0366 (2013.01); H05K 1/185 (2013.01); H05K 3/30 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0881 (2013.01); B29K 2307/04 (2013.01); B29K 2309/08 (2013.01); B29L 2031/34 (2013.01); H05K 2201/0275 (2013.01);
Abstract

A fiber-composite part having one or more electronic components that are located in arbitrary regions of the internal volume of the part are fabricated using a preform charge. The preform charge has a structure that corresponds to that of the mold cavity in which the part is being formed. By incorporating the electronic components in the preform charge, such components are then precisely located, spatially oriented, and constrained, and such location and orientation is maintained during molding to produce a part with the electronic components in the desired locations and orientations within its internal volume.


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