The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2023
Filed:
Dec. 11, 2017
Applicant:
Daicel Polymer Ltd., Tokyo, JP;
Inventors:
Assignee:
DAICEL POLYMER LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B23K 26/352 (2014.01); B29C 43/18 (2006.01); B29C 65/70 (2006.01);
U.S. Cl.
CPC ...
B23K 26/352 (2015.10); B29C 43/18 (2013.01); B29C 45/14 (2013.01); B29C 45/14311 (2013.01); B29C 45/14467 (2013.01); B29C 45/14491 (2013.01); B29C 65/70 (2013.01); B29C 2045/1454 (2013.01);
Abstract
A sealing method for sealing an opening of a metallic molded body with a resin molded body, the metallic molded body having a cavity therein and an opening connected to the cavity, includes a step of irradiating laser light onto a joining surface on a periphery of the opening of the metallic molded body in an energy density of 1 MW/cmor more and at an irradiation rate of 2000 mm/sec or more to roughen the surface, and a step of placing, in a mold, a portion including the joining surface of the metallic molded body roughened in the preceding step and sealing the opening with a resin molded body formed by injection molding or compression molding of a resin.