The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Dec. 10, 2021
Applicant:

Ableprint Technology Co., Ltd., Miaoli County, TW;

Inventors:

Chih-Horng Horng, Hsinchu, TW;

Hsu-Wen Wu, Kaohsiung, TW;

Chi-Chieh Lai, Taichung, TW;

Assignee:

ABLEPRINT IECHNOLOGY CO., LTD., Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); B23K 3/08 (2006.01); B23K 37/04 (2006.01); B23K 1/008 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0069 (2013.01); B23K 1/008 (2013.01); B23K 3/087 (2013.01); B23K 37/0408 (2013.01); H05K 13/0465 (2013.01); B23K 2101/42 (2018.08);
Abstract

Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.


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