The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Jun. 28, 2019
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventor:
Seiichirou Itou, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/10 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0284 (2013.01); H05K 3/108 (2013.01); H05K 3/0052 (2013.01); H05K 3/381 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09863 (2013.01); H05K 2201/09981 (2013.01); H05K 2203/1527 (2013.01);
Abstract
A wiring substrate includes: an insulating substrate comprising a corner constituted by two adjacent surfaces; wiring located continuously across the corner; wherein on at least one of the two adjacent surfaces, a part of the wiring disposed at an edge located at the corner has a thickness larger than a part of the wiring disposed away from the edge.