The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

May. 29, 2019
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventor:

Kushal Bhattacharjee, Kernersville, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/25 (2006.01); H03H 3/08 (2006.01); H03H 3/007 (2006.01); H03H 3/02 (2006.01); H03H 9/13 (2006.01); H03H 9/145 (2006.01); H03H 9/17 (2006.01); H03H 9/00 (2006.01); H03H 9/15 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02787 (2013.01); H03H 3/0072 (2013.01); H03H 3/0077 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/0009 (2013.01); H03H 9/0296 (2013.01); H03H 9/02228 (2013.01); H03H 9/02244 (2013.01); H03H 9/02259 (2013.01); H03H 9/02275 (2013.01); H03H 9/02338 (2013.01); H03H 9/0538 (2013.01); H03H 9/13 (2013.01); H03H 9/131 (2013.01); H03H 9/145 (2013.01); H03H 9/14564 (2013.01); H03H 9/15 (2013.01); H03H 9/17 (2013.01); H03H 9/25 (2013.01); H03H 2003/027 (2013.01); H03H 2009/02165 (2013.01); H03H 2009/02496 (2013.01); H03H 2009/155 (2013.01);
Abstract

A micro-electrical-mechanical system (MEMS) guided wave device includes a plurality of electrodes arranged below a piezoelectric layer (e.g., either embedded in a slow wave propagation layer or supported by a suspended portion of the piezoelectric layer) and configured for transduction of a lateral acoustic wave in the piezoelectric layer. The piezoelectric layer permits one or more additions or modifications to be made thereto, such as trimming (thinning) of selective areas, addition of loading materials, sandwiching of piezoelectric layer regions between electrodes to yield capacitive elements or non-linear elastic convolvers, addition of sensing materials, and addition of functional layers providing mixed domain signal processing utility.


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