The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jun. 20, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Makoto Sawamura, Nagaokakyo, JP;

Seiji Kai, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 3/08 (2006.01); G10K 11/36 (2006.01); H03H 9/02 (2006.01); H03H 9/25 (2006.01); H03H 9/72 (2006.01);
U.S. Cl.
CPC ...
H03H 3/08 (2013.01); G10K 11/36 (2013.01); H03H 9/02574 (2013.01); H03H 9/25 (2013.01); H03H 9/72 (2013.01);
Abstract

An elastic wave device manufacturing method includes a preparing a piezoelectric wafer on which IDT electrodes are provided in elastic wave device forming portions, providing on a first main surface of the piezoelectric wafer support layers in the elastic wave device forming portions, bonding a cover member to cover the support layers to obtain a multilayer body, cutting the multilayer body in a first direction multiple times, cutting the multilayer body in a second direction orthogonal to the first direction to obtain elastic wave devices, in which a resin layer extends across a boundary between the elastic wave device forming portions adjacent to each other on the first main surface of the piezoelectric wafer, and the second cutting step is performed in a state in which the resin layer is present.


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