The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Mar. 12, 2020
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Shou Matsumoto, Kyoto, JP;
Isao Takenaka, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 5/18 (2006.01); H01P 1/15 (2006.01);
U.S. Cl.
CPC ...
H01P 1/15 (2013.01); H01P 5/18 (2013.01); H01P 5/184 (2013.01);
Abstract
Isolation characteristics of a directional coupler are improved. A high-frequency module () includes a substrate () and a directional coupler () provided on the substrate (). The directional coupler () includes a main line (), a sub line (), and an impedance adjustment portion (). The sub line () is electromagnetically coupled to the main line (). The impedance adjustment portion () is provided in the sub line (), and adjusts impedance of the directional coupler (). The impedance adjustment portion () is electrically connected to an inductor of the substrate ().