The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Feb. 26, 2018
Applicant:
Kcf Technologies Co., Ltd., Anyang-si, KR;
Inventor:
Seung Min Kim, Anyang-si, KR;
Assignee:
SK NEXILIS CO., LTD., Jeongeup-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/00 (2006.01); H01M 4/66 (2006.01); C25D 1/04 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); H01M 50/534 (2021.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/667 (2013.01); C25D 1/04 (2013.01); H01M 4/661 (2013.01); H01M 50/534 (2021.01); H05K 1/09 (2013.01); H05K 3/022 (2013.01); H01M 2004/027 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0779 (2013.01);
Abstract
An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mmand a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below.MBF=(maximum Young's modulus−minimum Young's modulus)/(average Young's modulus)  [Formula 1]