The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Mar. 15, 2021
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Mitsuo Sano, Kanagawa, JP;
Susumu Obata, Kanagawa, JP;
Kazuhito Higuchi, Kanagawa, JP;
Kazuo Shimokawa, Kanagawa, JP;
Assignee:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/94 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 21/306 (2006.01); H01L 21/288 (2006.01);
U.S. Cl.
CPC ...
H01L 29/945 (2013.01); H01L 21/30604 (2013.01); H01L 29/0665 (2013.01); H01L 29/66181 (2013.01); H01L 21/288 (2013.01);
Abstract
A structural body according to an embodiment includes a conductive substrate. A main surface of the conductive substrate includes a first region and a second region adjacent to the first region and lower in height than the first region. The first region is provided with one or more recesses having a bottom, a position of which is lower than a position of the second region. A surface region of the conductive substrate on a side of the main surface includes a porous structure at a position between the second region and the one or more recesses.