The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Dec. 07, 2017
Applicant:
Agc Inc., Chiyoda-ku, JP;
Inventors:
Kazutaka Ono, Tokyo, JP;
Takatoshi Yaoita, Tokyo, JP;
Reo Usui, Tokyo, JP;
Kenichi Ebata, Tokyo, JP;
Jun Akiyama, Tokyo, JP;
Assignee:
AGC Inc., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); B32B 43/00 (2006.01); B32B 17/00 (2006.01); B32B 7/12 (2006.01); C03C 3/091 (2006.01); H01L 21/683 (2006.01); H01L 29/786 (2006.01); B32B 38/10 (2006.01); B32B 7/06 (2019.01); C03C 27/10 (2006.01); B32B 17/06 (2006.01); G02F 1/1341 (2006.01); G02F 1/1335 (2006.01); G02F 1/1368 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1266 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 17/00 (2013.01); B32B 17/06 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); C03C 3/091 (2013.01); C03C 27/10 (2013.01); H01L 21/6835 (2013.01); H01L 27/1222 (2013.01); H01L 29/78672 (2013.01); B32B 2307/30 (2013.01); B32B 2307/308 (2013.01); B32B 2307/546 (2013.01); B32B 2307/734 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01); G02F 1/1341 (2013.01); G02F 1/1368 (2013.01); G02F 1/13415 (2021.01); G02F 1/133516 (2013.01); G02F 2202/104 (2013.01); H01L 27/1274 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68386 (2013.01);
Abstract
A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.