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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11587879 B1

PDFFull Text
Date of Patent:
Feb. 21, 2023

Filed:

Jan. 05, 2021

Electronic apparatus and manufacturing method thereof

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Naoki Takizawa, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Nicholas J Tobergte

Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/538 (2006.01); H01L 21/50 (2006.01); H01L 23/532 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01); H01L 21/60 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5385 (2013.01); H01L 21/4871 (2013.01); H01L 21/50 (2013.01); H01L 23/3735 (2013.01); H01L 23/53228 (2013.01); H01L 23/564 (2013.01); H01L 24/95 (2013.01); H01L 25/0655 (2013.01); H05K 1/0306 (2013.01); H01L 2021/60135 (2013.01); H05K 3/244 (2013.01);
Abstract

An electronic device includes a first part, and a circuit plate including a circuit substrate, a plating film made of a plating material and being disposed on a front surface of the substrate. The plating film includes a first part region on which the first part is disposed via a first solder, and a liquid-repellent region extending along a periphery side of the first part region in a surface layer of the plating film, and having a liquid repellency greater than a liquid repellency of the plating film. The liquid-repellent region includes a resist region. The plating film includes a remaining portion between the liquid-repellent region and the front surface of the circuit substrate in a thickness direction of the plating film orthogonal to the front surface. The remaining portion is made of the plating material and is free of the oxidized plating material.

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