The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Dec. 09, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Kazutaka Suzuki, Kuwana, JP;

Kazuhiro Nakanishi, Yokkaichi, JP;

Kazuhiro Nojima, Yokkaichi, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 27/11556 (2017.01); H01L 27/11582 (2017.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 23/5226 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 27/11556 (2013.01); H01L 27/11582 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01);
Abstract

In one embodiment, a semiconductor device includes a first insulator, a plurality of interconnections provided in the first insulator. The device further includes a second insulator provided on the first insulator and the plurality of interconnections, and a conductor provided on a first interconnection among the plurality of interconnections and having a shape that is projected upwardly with respect to the first interconnection in the second insulator. The device further includes a plug provided on the first interconnection via the conductor. The device further includes a first pad provided above the plug and electrically connected to the plug, and a second pad provided on the first pad and electrically connected to the first pad.


Find Patent Forward Citations

Suzuki, Kazutaka. (2023). Semiconductor device and method of manufacturing same (U.S. Patent No. 11587871). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11587871

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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