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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11587861 B1

PDFFull Text
Date of Patent:
Feb. 21, 2023

Filed:

Jan. 22, 2021

Semiconductor device and manufacturing method thereof

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Hiroyuki Nogawa, Nagano, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Telly D Green

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/053 (2006.01); H01L 23/15 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49844 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/15 (2013.01); H01L 23/16 (2013.01); H01L 23/296 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83203 (2013.01);
Abstract

A semiconductor device including an insulating circuit board. The insulating circuit board has an insulating plate, a plurality of circuit patterns disposed on a front surface of the insulating plate, any adjacent two of the circuit patterns having a gap therebetween, each circuit pattern having at least one corner, each corner being in a corner area that covers the corner and a portion of each gap adjacent to the corner, and a buffer material containing resin, applied at a plurality of corner areas, to fill the gaps in the plurality of corner areas.

Find Patent Forward Citations

Nogawa, Hiroyuki. (2023). Semiconductor device and manufacturing method thereof (U.S. Patent No. 11587861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11587861

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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