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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11587859 B1

PDFFull Text
Date of Patent:
Feb. 21, 2023

Filed:

Oct. 27, 2021

Wiring protection layer on an interposer with a through electrode

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Yukyung Park, Hwaseong-si, KR;

Seungkwan Ryu, Seongnam-si, KR;

Yunseok Choi, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Alonzo Chambliss

Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/14 (2006.01); H01L 23/48 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/48 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01); H01L 23/3121 (2013.01); H01L 23/3171 (2013.01); H01L 23/481 (2013.01); H01L 23/5381 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/53295 (2013.01); H01L 24/06 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01);
Abstract

An interposer includes a base layer having a first surface and a second surface, a redistribution structure on the first surface, an interposer protection layer on the second surface, a pad wiring layer on the interposer protection layer, an interposer through electrode passing through the base layer and the interposer protection layer and electrically connecting the redistribution structure to the pad wiring layer, an interposer connection terminal attached to the pad wiring layer, and a wiring protection layer including a first portion covering a portion of the interposer protection layer adjacent to the pad wiring layer, a second portion covering a portion of a top surface of the pad wiring layer, and a third portion covering a side surface of the pad wiring layer. The third portion is disposed between the first portion and the second portion. The first to third portions have thicknesses different from each other.

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