The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Jul. 21, 2020
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Hiroyuki Masumoto, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/54 (2006.01); H01L 23/04 (2006.01); H01L 23/043 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 21/54 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 23/498 (2013.01); H01L 24/48 (2013.01); H01L 23/04 (2013.01); H01L 23/041 (2013.01); H01L 23/043 (2013.01); H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/367 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48225 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10254 (2013.01); H01L 2924/10272 (2013.01);
Abstract
A semiconductor module includes: a case; a semiconductor chip provided inside the case; a seal material injected to inside of the case and sealing the semiconductor chip; and a lid provided inside the case and contacting an upper surface of the seal material, wherein a tapered portion is provided at an end portion of the lid on an upper surface side, a gap is provided between a side surface of the end portion of the lid and an inner side surface of the case, and the seal material crawls up to the tapered portion through the gap.