The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Apr. 30, 2019
Applicant:

Te Connectivity Corporation, Berwyn, PA (US);

Inventors:

Alexander Raymond King, Lancaster, PA (US);

Marc Keener, Kernersville, NC (US);

Leigh Marolf, Harrisburg, PA (US);

Assignee:

TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 47/00 (2006.01); G01K 13/00 (2021.01); H01H 45/02 (2006.01); H01H 45/14 (2006.01);
U.S. Cl.
CPC ...
H01H 47/002 (2013.01); G01K 13/00 (2013.01); H01H 45/02 (2013.01); H01H 45/14 (2013.01); H01H 2239/06 (2013.01);
Abstract

Electromechanical relay constructions comprise an external housing, a pair of switchable electrical contacts disposed within the housing, an element for activating the pair of electrical contacts, and a temperature sensing element disposed within the housing adjacent the electrical contracts. The temperature sensing element provides a signal for determining the temperature within the relay housing. The relay may comprise two or more temperature sensing elements disposed within the housing a desired distance from one another. The temperature sensing element may be attached to a member or substrate disposed within the housing, may be attached to an existing internal structure of the housing, or may be attached to one of the contacts. The temperature sensing element may be selected from the group consisting of resistance temperature detectors, negative temperature coefficient thermistors, thermopile sensors, thermocouples, and combinations thereof.


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