The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

May. 15, 2020
Applicants:

Fuzhou Boe Optoelectronics Technology Co., Ltd., Fujian, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Ye Hu, Beijing, CN;

Kai Diao, Beijing, CN;

Qingna Hou, Beijing, CN;

Hongzhou Xie, Beijing, CN;

Shangtao Zheng, Beijing, CN;

Renhui Yu, Beijing, CN;

Wen Zha, Beijing, CN;

Xin Chen, Beijing, CN;

Meizhen Chen, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09G 3/32 (2016.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
G09G 3/32 (2013.01); H01L 27/124 (2013.01); G09G 2300/0408 (2013.01); G09G 2300/0426 (2013.01); G09G 2300/0809 (2013.01); G09G 2310/0267 (2013.01); G09G 2310/0275 (2013.01); G09G 2310/0278 (2013.01); G09G 2310/0281 (2013.01); G09G 2330/06 (2013.01); H01L 27/3276 (2013.01);
Abstract

The present disclosure provides a display panel, a method for driving the display panel and a display device. The display panel includes a display region and a non-display region. The non-display region includes a first bonding region, and further includes first connection lines connected to a plurality of gate lines respectively and second connection lines connected to a plurality of data lines respectively. The display panel further includes at least one chip on film, the chip on film includes a second bonding region, a first region, and a second region between the second bonding region and the first region. A scanning driving integrated circuitry connected to the second bonding region via first wirings and a data driving integrated circuitry connected to the second bonding region via second wirings are bonded in the first region. The first wirings and the second wirings are arranged at different layers in the second region.


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