The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jul. 02, 2020
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Tsung-Ying Ke, Hsinchu, TW;

Chih-Tsung Lee, Hsinchu, TW;

Ting Kang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G09F 9/30 (2006.01); H01L 27/32 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 51/56 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
G09F 9/301 (2013.01); H01L 27/322 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 51/5246 (2013.01); H01L 51/5275 (2013.01); H01L 51/56 (2013.01); H01L 2251/5338 (2013.01);
Abstract

A flexible device array substrate includes: a substrate, a metal-containing layer, and an electronic component layer. The metal-containing layer is disposed on the substrate. The metal-containing layer includes: a first layer and a second layer. The first layer is located on a side close to the substrate, and the first layer contains a first metal oxide to form a peeling interface in the first layer. The second layer is located on a side away from the substrate, and the second layer contains a second metal oxide. The oxidation number of the metal in the second metal oxide is smaller than the oxidation number of the metal in the first metal oxide. The electronic component layer is disposed above the metal-containing layer. A method of manufacturing the flexible device array substrate is also provided.


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