The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Aug. 21, 2019
Applicant:

Sumitomo Bakelite Co., Ltd., Shinagawa-ku, JP;

Inventors:

Hironari Inaba, Shinagawa-ku, JP;

Kazufusa Onodera, Shinagawa-ku, JP;

Assignee:

SUMITOMO BAKELITE CO., LTD., Shinagawa-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 23/08 (2006.01); B32B 27/08 (2006.01); B32B 27/34 (2006.01); G02B 1/14 (2015.01); G02B 5/30 (2006.01); B29C 51/10 (2006.01); B29C 48/07 (2019.01); B29C 48/21 (2019.01); B29C 51/14 (2006.01); C09J 7/29 (2018.01); C09J 123/06 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); C09J 153/02 (2006.01); C09J 123/04 (2006.01); C09J 123/12 (2006.01); C09J 7/38 (2018.01); B29C 53/04 (2006.01);
U.S. Cl.
CPC ...
C09J 7/381 (2018.01); B29C 53/04 (2013.01); C09J 7/29 (2018.01); C09J 123/06 (2013.01); C09J 123/12 (2013.01); C09J 2301/122 (2020.08); C09J 2301/162 (2020.08); C09J 2423/00 (2013.01); C09J 2453/00 (2013.01);
Abstract

A protective film of the present invention is used at the time of performing heat bending on the resin substrate, and includes a base material layer and a pressure sensitive adhesive layer adhered to a resin substrate, in which the base material layer includes a first layer which is positioned on an opposite side of the pressure sensitive adhesive layer and has a melting point of 150° C. or higher, and includes a second layer which is positioned on a pressure sensitive adhesive layer side and has a melting point of lower than 150° C., the pressure sensitive adhesive layer has a melting point of lower than 150° C., and MFR of a thermoplastic resin contained in the second layer, which is measured in conformity with JIS K7210, is in a range of 0.5 g/10 min to 4.0 g/10 min.


Find Patent Forward Citations

Inaba, Hironari. (2023). Protective film (U.S. Patent No. 11584870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11584870

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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