The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Apr. 08, 2022
Applicant:

Stathera Ip Holdings Inc., Montreal, CA;

Inventors:

George Xereas, Montreal, CA;

Vahid Tayari, Montreal, CA;

Ahmed Khorshid, Montreal, CA;

Charles Allan, Montreal, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81B 7/00 (2006.01); H03H 9/02 (2006.01); H03H 9/24 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 7/0087 (2013.01); H03H 9/02448 (2013.01); B81B 2201/0271 (2013.01); H03H 2009/2442 (2013.01);
Abstract

A dual-output microelectromechanical system (MEMS) resonator can be operated selectively and concurrently in an in-plane mode of vibration and an out-of-plane mode of vibration to obtain, respectively, a first electrical signal having a first frequency and a second electrical signal having a second frequency that is less than the first frequency. The first and second electrical signals are mixed to obtain a third electrical signal having a third frequency, where the third frequency is proportional to a temperature of the MEMS resonator. The temperature is determined based on the third frequency. Values of the first and second frequencies can be adjusted based on the determined temperature to compensate for frequency deviations due to temperature deviations. Also described herein are methods and systems for determining the temperature of the dual-output MEMS and for performing frequency compensation, as well as a method of manufacturing the dual-output MEMS.


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