The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jan. 29, 2020
Applicant:

Te Connectivity Services Gmbh, Schaffhausen, CH;

Inventors:

Dwight David Zitsch, Carlisle, PA (US);

Megan Beers, Redwood City, CA (US);

Henry Burton Piper, III, Middletown, PA (US);

Aakriti Kharel, San Jose, CA (US);

Assignee:

TE CONNECTIVITY SOLUTIONS GmbH, Schaffhausen, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); G02B 6/36 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00663 (2013.01); G02B 6/3612 (2013.01);
Abstract

A method of preparing an overmolded optical fiber assembly comprising: (a) placing at least one flexible optical circuit in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being disposed within said bottom overmold cavity to define a first space between said substrate and said bottom surface; (b) flowing a polymer in at least said first space; (c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate; (d) flowing a polymer in at least a portion of said second space; and (e) removing said bottom and top molds to release said overmolded optical circuit.


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