The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2023
Filed:
Jul. 13, 2018
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Takayuki Shimizu, Tokyo, JP;
Akihisa Okuda, Tokyo, JP;
Ryota Ozaki, Tokyo, JP;
Shoya Mano, Tokyo, JP;
Masahiko Shimizu, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
This flexible mandrel for molding a composite material containing a thermosetting resin includes: a main body containing a first material; and a thermally conductive layer containing a second material having a higher thermal conductivity than the first material, the thermally conductive layer being formed so as to cover at least a portion of the main body. The thermally conductive layer extends from a contacting surface of the flexible mandrel, which comes into contact with the composite material during molding, to a non-contacting surface which does not come into contact with the composite material.