The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jul. 06, 2020
Applicant:

Nissei Plastic Industry Co., Ltd., Nagano, JP;

Inventors:

Hozumi Yoda, Nagano, JP;

Hirofumi Murata, Nagano, JP;

Shinichi Kasuga, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 44/42 (2006.01); B29C 44/34 (2006.01); B29C 44/60 (2006.01); B29C 45/76 (2006.01); B29C 45/77 (2006.01); B29C 45/80 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
B29C 44/42 (2013.01); B29C 44/3415 (2013.01); B29C 44/60 (2013.01); B29C 45/7653 (2013.01); B29C 45/77 (2013.01); B29C 45/80 (2013.01); B29C 2945/76498 (2013.01); B29C 2945/76561 (2013.01); B29C 2945/76581 (2013.01); B29C 2945/76869 (2013.01); B29K 2105/04 (2013.01);
Abstract

To provide a new foam molding method and injection molding machine capable of solving variation in a wall thickness and a foamed state, sensor corrosion, a complexity of sensor positioning, and the like. The above-described problem is solved by a foam molding method comprising a resin filling step of filling a mold (), clamped by a predetermined mold clamping force (Pc), with a resin (R) at a predetermined molding injection pressure (Pi), a filling stopping step of stopping the filling of the resin (R) when, while monitoring a mold gap (Lm) of the mold () during the filling, a predetermined mold gap value set in advance is reached, a surface layer curing and filled resin cooling step of curing a surface layer of the resin (R) for a certain time and cooling the filled resin (R) for a certain time after the filling of the resin (R) is stopped, a volume controlling step of controlling a volume increase by reducing the mold clamping force after curing the surface layer of the resin (R) for a certain time, and a taking out step of taking out a foam-molded product by opening the mold () after the volume control is performed and after cooling the filled resin (R) for a certain time.


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