The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

May. 23, 2019
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

William Thomas Carter, Galway, NY (US);

Mark Kevin Meyer, Centerville, OH (US);

Andrew David Deal, Niskayuna, NY (US);

Mark Allen Cheverton, Malta, NY (US);

Smara Jyoti Kalita, Cincinnati, OH (US);

Michael Francis Xavier Gigliotti, Glenville, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 12/00 (2021.01); C21D 1/42 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01); B22F 12/17 (2021.01); B22F 12/30 (2021.01); B22F 12/90 (2021.01); B33Y 50/02 (2015.01); B22F 7/06 (2006.01); B22F 5/04 (2006.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
B22F 12/00 (2021.01); B22F 12/17 (2021.01); B22F 12/30 (2021.01); B22F 12/38 (2021.01); B22F 12/90 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); C21D 1/42 (2013.01); B22F 5/04 (2013.01); B22F 7/062 (2013.01); B22F 10/10 (2021.01); B22F 2999/00 (2013.01); B33Y 50/02 (2014.12); Y02P 10/25 (2015.11);
Abstract

The disclosure relates to an apparatus for manufacturing a metallic component, and corresponding methods. The apparatus may include a build plate with a build surface and an aperture. The apparatus may also include an actuator operable to translate a metallic component such that an end portion of the metallic component is positioned within the aperture of the build plate and below the build surface. The apparatus may further include a seal coupled within the aperture of the build plate and configured to engage the end portion of the metallic component. The aperture of the build plate, the seal, and the end portion of the metallic component may cooperate to form a powder bed to hold metallic powder therein. The apparatus may also include an external heat control mechanism operable to form a predetermined temperature profile of the end portion of the component to prevent cracking of the component.


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