The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jul. 16, 2021
Applicant:

Waymo Llc, Mountain View, CA (US);

Inventors:

Augusto Tazzoli, San Jose, CA (US);

Blaise Gassend, East Palo Alto, CA (US);

Assignee:

Waymo LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); G01S 17/42 (2006.01); G01S 7/481 (2006.01); G01S 17/931 (2020.01);
U.S. Cl.
CPC ...
H05K 1/0274 (2013.01); G01S 7/4813 (2013.01); G01S 17/42 (2013.01); G01S 17/931 (2020.01); H05K 1/113 (2013.01); H05K 2201/094 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01);
Abstract

A Printed Circuit Board (PCB) includes a via extending through at least one layer of the PCB. The PCB may also include a first catch pad connected to the via and located within a first metal layer of the PCB. The first catch pad may have a first size. The PCB may further include a second catch pad connected to the via and located within a second metal layer of the PCB. The second catch pad may have a second size greater than the first size. The second catch pad may overlap horizontally with a portion of a metallic feature in the first metal layer to obstruct light incident on a first side of the PCB from transmission to a second side of the PCB through a region of dielectric material near the via.


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