The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
May. 06, 2021
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yeong-E Chen, Miao-Li County, TW;
Cheng-En Cheng, Miao-Li County, TW;
Yu-Ting Liu, Miao-Li County, TW;
Assignee:
InnoLux Corporation, Miao-Li County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/485 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0269 (2013.01); H05K 3/022 (2013.01); H05K 3/46 (2013.01);
Abstract
A package device and a manufacturing method thereof are provided. The package device includes a redistribution layer including a first dielectric layer, a conductive layer, and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test mark, the test mark includes a plurality of conductive patterns formed of the conductive layer, and the conductive patterns are arranged in a ring shape.