The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Nov. 30, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Dietmar Straeussnigg, Villach, AT;

Luis Hernandez, Madrid, ES;

Andreas Wiesbauer, Poertschach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 19/04 (2006.01); B81B 3/00 (2006.01); H04R 1/02 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/0021 (2013.01); H04R 1/02 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MicroElectroMechanical System (MEMS) includes a MEMS device; a feature extraction component coupled to an output of the MEMS device, wherein the feature extraction component is configured to provide a plurality of features of an output signal of the MEMS device; and a low data rate interface coupled to the feature extraction components, wherein the low data rate interface is configured to transmit the plurality of features of the output signal of the MEMS device, and wherein a low data rate of the low data rate interface is determined by a number of the plurality of features transmitted, wherein the MEMS device, the feature extraction component, and the low data rate interface are packaged together in a semiconductor package.


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