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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11581508 B1

PDFFull Text
Date of Patent:
Feb. 14, 2023

Filed:

Jul. 13, 2020

Thin film packaging structure and display panel

Applicants:

Chengdu Boe Optoelectronics Technology Co., Ltd., Chengdu, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhiliang Jiang, Beijing, CN;

Shilong Wang, Beijing, CN;

Ping Wen, Beijing, CN;

Assignees:

Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan, CN;

BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;

Attorneys:

Perilla Knox & Hildebrandt LLP

Kenneth A. Knox

Primary Examiner:

Ida M Soward

Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 33/44 (2010.01); H01L 33/12 (2010.01); G02F 1/13 (2006.01); G06F 1/16 (2006.01); G09F 9/30 (2006.01); H01L 23/00 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); G02F 1/133305 (2013.01); G06F 1/1641 (2013.01); G06F 1/1652 (2013.01); G09F 9/301 (2013.01); H01L 23/564 (2013.01); H01L 33/12 (2013.01); H01L 33/44 (2013.01); H01L 51/0097 (2013.01); H01L 51/52 (2013.01); H01L 2251/303 (2013.01); H01L 2251/5338 (2013.01);
Abstract

This disclosure relates to the field of display technologies and, in particular to a thin film packaging structure and a display panel. A thin film packaging structure includes a first inorganic packaging layer for covering a device to be packaged; an organic packaging layer formed at a side of the first inorganic packaging layer; a second inorganic packaging layer formed at a side of the organic packaging layer facing away from the first inorganic packaging layer; and at least one first inorganic adjusting layer formed at a side of the first inorganic packaging layer facing away from the device to be packaged. The at least one first inorganic adjusting layer has an elasticity modulus greater than that of the first inorganic packaging layer or the second inorganic packaging layer.

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