The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jan. 25, 2018
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Masashi Akahane, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/09 (2006.01); B81B 7/02 (2006.01); H01L 23/04 (2006.01); H04B 11/00 (2006.01); H01L 25/18 (2006.01); H01L 25/04 (2014.01); G01D 11/24 (2006.01); H01L 25/16 (2006.01); H01L 27/20 (2006.01); H01L 41/311 (2013.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 41/09 (2013.01); B81B 7/02 (2013.01); G01D 11/24 (2013.01); H01L 23/04 (2013.01); H01L 25/04 (2013.01); H01L 25/162 (2013.01); H01L 25/18 (2013.01); H01L 27/1255 (2013.01); H01L 27/20 (2013.01); H01L 29/7869 (2013.01); H01L 41/311 (2013.01); H04B 11/00 (2013.01); H05K 1/115 (2013.01); H05K 1/182 (2013.01); B81B 2201/0264 (2013.01); B81B 2207/096 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01);
Abstract

A pressure sensor element and a receiving circuit are formed on an IC chip. A transmitting circuit and a piezoelectric element of an actuator are respectively formed on a transmitting chip and a piezoelectric chip. The piezoelectric chip and the pressure sensor face each other separated by a distance in an airtight first space surrounded by a package main body and a base substrate. Dielectric breakdown voltage of signal transmission from the primary side to the secondary side is set by the distance. The first space is a pressure propagation region including an insulating medium capable of transmitting vibrations of the piezoelectric element as pressure. The signal transmission is performed with high insulation by the pressure generated in the pressure propagation region between components integrated in a single module by insulating the primary side and the secondary side from each other by the insulating medium of the pressure propagation region.


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