The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Apr. 20, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Koji Ohashi, Matsumoto, JP;

Chikara Kojima, Matsumoto, JP;

Hiroshi Matsuda, Chino, JP;

Hironori Suzuki, Chino, JP;

Shuichi Tanaka, Chino, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 41/047 (2006.01); B06B 1/06 (2006.01); A61B 8/00 (2006.01); H01L 27/20 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); B06B 1/0622 (2013.01); B06B 1/0629 (2013.01); H01L 41/047 (2013.01); H01L 41/0475 (2013.01); A61B 8/4444 (2013.01); A61B 8/4477 (2013.01); A61B 8/4494 (2013.01); H01L 27/20 (2013.01);
Abstract

A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.


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