The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jun. 05, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Albert Birner, Regensburg, DE;

Rudolf Berger, Regensburg, DE;

Helmut Brech, Lappersdorf, DE;

Olaf Storbeck, Dresden, DE;

Haifeng Sun, Regensburg, DE;

John Twynam, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 21/268 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 29/10 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/417 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); H01L 21/0217 (2013.01); H01L 21/268 (2013.01); H01L 21/26546 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 29/1033 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/41725 (2013.01); H01L 29/7786 (2013.01);
Abstract

A semiconductor body having a base carrier portion and a type III-nitride semiconductor portion is provided. The type III-nitride semiconductor portion includes a heterojunction and two-dimensional charge carrier gas. One or more ohmic contacts are formed in the type III-nitride semiconductor portion, the ohmic contacts forming an ohmic connection with the two-dimensional charge carrier gas. A gate structure is configured to control a conductive state of the two-dimensional charge carrier gas. Forming the one or more ohmic contacts comprises forming a structured laser-reflective mask on the upper surface of the type III-nitride semiconductor portion, implanting dopant atoms into the upper surface of the type III-nitride semiconductor portion, and performing a laser thermal anneal that activates the implanted dopant atoms.


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