The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Oct. 01, 2020
Applicant:

Teledyne Scientific & Imaging, Llc, Thousand Oaks, CA (US);

Inventor:

Majid Zandian, Calabasas, CA (US);

Assignee:

Teledyne Scientific & Imaging, LLC, Thousand Oaks, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 33/58 (2010.01); H01L 31/0232 (2014.01);
U.S. Cl.
CPC ...
H01L 27/14636 (2013.01); H01L 27/1462 (2013.01); H01L 27/1469 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14643 (2013.01); H01L 27/14685 (2013.01); H01L 27/14694 (2013.01); H01L 27/14696 (2013.01); H01L 31/0232 (2013.01); H01L 31/02327 (2013.01); H01L 33/58 (2013.01);
Abstract

A curved FPA comprises an array of detectors, with mesas etched between the detectors such that they are electrically and physically isolated from each other. Metallization deposited at the bottom of the mesas reconnects the detectors electrically and thereby provides a common ground between them. Strain induced by bending the FPA into a curved shape is across the metallization and any backfill epoxy, rather than across the detectors. Indium bumps are evaporated onto respective detectors for connection to a readout integrated circuit (ROIC). An ROIC coupled to the detectors is preferably thinned, and the backside of the ROIC may also include mesas such that the ROIC is reticulated.


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