The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jul. 21, 2020
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Aurelien R. Hubert, Saratoga, CA (US);

Jee Tung Tan, Singapore, SG;

Steven Webster, Singapore, SG;

Douglas S. Brodie, Los Gatos, CA (US);

Qiang Yang, Fremont, CA (US);

Masahito Morita, Kanagawa-ken, JP;

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/225 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14629 (2013.01); H01L 27/14627 (2013.01); H04M 1/0264 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/22521 (2018.08);
Abstract

A hybrid sensor shift platform for an optical image stabilization (OIS) actuator mechanism in compact camera modules includes two or more substrates. A top substrate is composed of an organic material (e.g., a resin) to reduce mass, reduce magnetic interaction with permanent magnets, and improve reliability. One or more lower substrates of the hybrid sensor shift platform are ceramic substrates that provide the benefits of ceramics for connection to the image sensor. The organic substrate is connected via a solder bond process to the lower ceramic substrate(s). The connection between the substrates is reinforced with an under-fill of epoxy that surrounds the solder bonds, thus creating a full interface between the substrates within the overlap.


Find Patent Forward Citations

Loading…