The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Dec. 23, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Doo Il Kim, Suwon-si, KR;

Won Wook So, Suwon-si, KR;

Young Sik Hur, Suwon-si, KR;

Jung Chul Gong, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01Q 1/52 (2006.01); H01Q 1/38 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3185 (2013.01); H01L 23/49816 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/20 (2013.01); H01L 25/0657 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/526 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/214 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19106 (2013.01);
Abstract

An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.


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