The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Apr. 07, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Junhyung Kim, Yongin-si, KR;
Kyeongbin Lim, Seoul, KR;
Minsoo Han, Hwaseong-si, KR;
Minwoo Rhee, Seoul, KR;
Inbae Chang, Chuncheon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
KNU-lndustry Cooperation Foundation, Chuncheon-si, KR;
Abstract
A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.