The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Jun. 28, 2021
Applicant:
Arcsoft Corporation Limited, Hangzhou, CN;
Inventors:
Kwang Sue Park, Seoul, KR;
Dong Wook Nam, Suwon-si, KR;
Byung Il Min, Suwon-si, KR;
Bong Seok Kim, Gwangju-si, KR;
Assignee:
ARCSOFT CORPORATION LIMITED, Hangzhou, CN;
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01);
U.S. Cl.
CPC ...
G06V 40/1324 (2022.01); G06V 40/1318 (2022.01);
Abstract
Semiconductor package having self-aligned structure disclosed. Semiconductor package includes a semiconductor chip having an active area and at least one marginal area that is located around the active area, wherein at least one alignment bar is arranged on the marginal area and a top structure being arranged on the semiconductor chip and having a groove being formed on a bottom surface, wherein the groove is configured for accommodating the alignment bar.