The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jan. 25, 2019
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Lembit Salasoo, Niskayuna, NY (US);

Vipul K. Gupta, Guilderland, NY (US);

Xiaohu Ping, Niskayuna, NY (US);

Subhrajit Roychowdhury, Schenectady, NY (US);

Justin Gambone, Jr., Niskayuna, NY (US);

Naresh Iyer, Schenectady, NY (US);

Xiaolei Shi, Schnectady, NY (US);

Mengli Wang, Niskayuna, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06N 7/00 (2006.01); G06N 20/00 (2019.01); G06F 30/00 (2020.01); B22F 10/20 (2021.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); G06F 119/18 (2020.01); B22F 10/30 (2021.01);
U.S. Cl.
CPC ...
G06N 7/00 (2013.01); B22F 10/20 (2021.01); G06F 30/00 (2020.01); G06N 20/00 (2019.01); B22F 10/30 (2021.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); G06F 2119/18 (2020.01);
Abstract

Determining a quality score for a part manufactured by an additive manufacturing machine based on build parameters and sensor data without the need for extensive physical testing of the part. Sensor data is received from the additive manufacturing machine during manufacture of the part using a first set of build parameters. The first set of build parameters is received. A first algorithm is applied to the first set of build parameters and the received sensor data to generate a quality score. The first algorithm is trained by receiving a reference derived from physical measurements performed on at least one reference part built using a reference set of build parameters. The quality score is output via the communication interface of the device.


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