The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2023
Filed:
Jun. 10, 2022
Applicant:
Western Digital Technologies, Inc., San Jose, CA (US);
Inventors:
Assignee:
Western Digital Technologies, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G06F 11/10 (2006.01); G06F 13/40 (2006.01); H01L 25/18 (2006.01); G11C 16/26 (2006.01); G11C 16/10 (2006.01); G06F 13/16 (2006.01); G11C 16/04 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0659 (2013.01); G06F 3/0608 (2013.01); G06F 3/0679 (2013.01); G06F 11/1076 (2013.01); G06F 13/1668 (2013.01); G06F 13/4027 (2013.01); G11C 16/10 (2013.01); G11C 16/26 (2013.01); H01L 25/18 (2013.01); G11C 16/0483 (2013.01);
Abstract
An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die includes a memory structure of non-volatile memory cells. The control die is configured to program user data to and read user data from the memory die in response to commands from a memory controller. To utilize space more efficiently on the memory die, the control die compacts fragmented data on the memory die.