The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jul. 19, 2018
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

William S. Lee, Fremont, CA (US);

Tyler B. Cater, San Jose, CA (US);

Shannon X. Yang, Sunnyvale, CA (US);

Justin D. Crosby, Cupertino, CA (US);

Timothy S. Lui, San Jose, CA (US);

Eric N. Nyland, Santa Clara, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01K 7/02 (2021.01); H04R 1/02 (2006.01); H04M 1/03 (2006.01); H04R 1/08 (2006.01); G01K 1/16 (2006.01); G06F 3/02 (2006.01); G06F 3/041 (2006.01); H04R 1/10 (2006.01); H04R 3/04 (2006.01);
U.S. Cl.
CPC ...
G01K 7/02 (2013.01); G01K 1/16 (2013.01); G06F 3/02 (2013.01); G06F 3/0412 (2013.01); H04M 1/03 (2013.01); H04R 1/025 (2013.01); H04R 1/08 (2013.01); H04R 1/1041 (2013.01); H04R 3/04 (2013.01); H04M 2250/12 (2013.01); H04R 1/023 (2013.01); H04R 2499/11 (2013.01);
Abstract

Aspects of the subject technology relate to electronic devices having sensors such as pressure sensors. A pressure sensor may be integrated into an audio component of an electronic device such that the pressure sensor is fluidly coupled to an environment external to a device housing via at least a portion of an internal cavity of the audio component housing. The audio component housing may include an opening. The pressure sensor may be mounted adjacent to or within the opening. The opening may be sealed to prevent passage of gas or liquid through the opening. The pressure sensor may be integrally formed with an inner wall of the audio component housing. The audio component may be a speaker or a microphone.


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