The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Jul. 11, 2018
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Kenji Ota, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C09K 5/14 (2006.01); H01M 10/613 (2014.01); H01M 10/655 (2014.01); C08J 3/075 (2006.01); C08K 3/00 (2018.01); H05K 1/02 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); C08G 77/14 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08J 3/075 (2013.01); C08K 3/00 (2013.01); C08L 83/04 (2013.01); H01M 10/613 (2015.04); H01M 10/655 (2015.04); C08G 77/12 (2013.01); C08G 77/14 (2013.01); C08G 77/20 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C08L 2312/08 (2013.01); H05K 1/0203 (2013.01);
Abstract

Provided is: a thermally conductive silicone gel composition which has a high thermal conductivity, and is less likely to flow out and slip off/drop off from a surface on which the gel composition is placed, even when the composition that has not been cured is placed on a sloped surface or in a vertical direction, and has excellent gap-filling ability with respect to a heat dissipation part, etc., and excellent repairability if desired; a thermally conductive member comprising the thermally conductive silicone gel composition; and a heat dissipation structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for a hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The gel composition has certain viscosity properties as disclosed herein.


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